Toshiba Releases New IC For Automotive Applications

KUALA LUMPUR, Oct 30 (Bernama) -- Toshiba Electronic Devices & Storage Corporation (Toshiba) has added ‘TC35681IFTG’ -- a new IC for automotive applications to its line-up of ICs compliant with Bluetooth® low energy (LE) core specification v5.0. According to Toshiba in a statement, the highly expandable and integrated device is also expected to be fully AEC-Q100 qualified in the 2019 spring. The new IC will deliver a wide operating temperature range, high RF transmission power and high RF reception sensitivity. The mixed-signal TC35681IFTG contains both analogue RF and baseband digital parts to provide a complete solution on a single chip. When used in conjunction with an external non-volatile memory, the new IC becomes a fully-fledged application processor that temporarily loads applications and stores in internal RAM (76KB). It can also be combined with an external host processor. Current applications include Remote Keyless Entry, On-Board Diagnostics to collect sensor data, Tire Pressure Monitoring Systems and other contributors to improved vehicle comfort and safety. More details at https://toshiba.semicon-storage.com/ap-en/top.html -- BERNAMA