ID :
188672
Wed, 06/15/2011 - 08:39
Auther :

IME LAUNCHES ELECTRONIC PACKAGING RESEARCH CONSORTIUM

By Tengku Noor Shamsiah Tengku Abdullah

SINGAPORE, June 15 (Bernama) -- Singapore's Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research, has launched its 11th Electronic Packaging Research Consortium (EPRC).

IME executive director, Prof Dim-Lee Kwong, said the launch aimed to address various challenges and develop advanced packaging technology.

"Since its initiation in 1996, this platform has injected invaluable research and development (R&D) capabilities into the operations of many local enterprises and multinational companies in the electronics packaging industry.

"EPRC started 15 years ago and we have gone through 10 cycles of projects with our members, offering high quality R&D expertise in packaging," he said at the launch here Wednesday.

He said the success of the consortium since 1996 was a testimony to the significance of this platform in offering companies engaged in pre-competitive R&D and looking to develop new capabilities to stay ahead of their competitors.

"While lending support to our local community in this frontier, IME is well-positioned on the roadmap to catalyse a suite of offerings in technological advancement and knowledge transfer to enhance the process innovations," he said.

EPRC11 consists of 23 company members spanning the whole supply chain of the industry from system, integrated device manufacturer, foundry, assembly & test, to equipment and material companies.
-- BERNAMA



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